PLEXIGLAS® PMMA FILMS AND EUROPLEX® COC FILMS
COC & PMMA Films for Microfluidic and Lab-on-Chip Applications
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In microfluidic systems, material choice defines performance. COC and PMMA films are used as cover layers in microfluidic chips that require optical clarity, thermal stability, and reliable sealing.
They support controlled fluid behavior and stable operation across diagnostic and analytical applications, including
- PCR microfluidic chips
- Fluorescence detection systems
- Capillary-driven microfluidic devices
- Molecular and cell analysis platforms
- Point-of-care diagnostics
MATERIALS DESIGNED FOR PRECISION PERFORMANCE IN MICROFLUIDICS
Microfluidic systems rely on materials that maintain optical clarity, dimensional stability, and precise control of fluid behavior. PLEXIGLAS® PMMA and EUROPLEX® COC films are engineered for Lab-on-a-chip and microfluidic applications where consistent performance is required.
Why PLEXIGLAS® PMMA and EUROPLEX® COC films perform?
- High Optical Clarity, which enables reliable signal detection and fluorescence imaging.
- Required Surface Characteristics that determine fluid flow behavior across microchannels
- Stable Thermal Behavior under thermal cycling, which supports PCR and other temperature-sensitive processes.
- Excellent Chemical Compatibility, which achieves inert behavior with reagents and biological samples, preserves assay integrity.
COC & PMMA FOR MICROFLUIDICS
Selecting the appropriate material depends on application requirements.
Compare Properties
| Optical clarity | Auto-fluorescence | Thermal resistance | Surface energy | Water absorption | |
| PLEXIGLAS® PMMA Films | High | Moderate | Moderate | Higher | Higher |
| EUROPLEX® COC Films | High | Low | Higher | Lower | Lower |
MATERIALS DESIGNED FOR EFFICIENT PROCESSING AND SCALE-UP
Microfluidic materials must integrate into manufacturing processes without introducing variability. PLEXIGLAS® PMMA and EUROPLEX® COC films are compatible with a wide range of established processing technologies. These include: Laser cutting; micro-milling; injection molding
They are also compatible with common bonding methods: Thermal bonding; solvent bonding; ultrasonic welding; laser welding.
This supports consistent device performance and reduces variability during scale-up.
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